US 11,726,046 B2
Multi-scale spectral imaging apparatuses and methods, and methods of manufacturing semiconductor devices by using the imaging methods
Jaehwang Jung, Suwon-si (KR); Hyejin Shin, Hwaseong-si (KR); Wookrae Kim, Suwon-si (KR); Gwangsik Park, Hwaseong-si (KR); Myungjun Lee, Seongnam-si (KR); and Yongju Jeon, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd.
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Apr. 8, 2021, as Appl. No. 17/225,275.
Claims priority of application No. 10-2020-0113195 (KR), filed on Sep. 4, 2020.
Prior Publication US 2022/0074867 A1, Mar. 10, 2022
Int. Cl. G01N 21/95 (2006.01); G01B 11/25 (2006.01)
CPC G01N 21/9501 (2013.01) [G01B 11/254 (2013.01); G01B 2210/56 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A multi-scale spectral imaging apparatus comprising:
a light source configured to generate and output light;
a stage having a measurement target thereon;
a line-scan spectral imaging (SI) optical system configured to:
measure the measurement target using a first scale;
slopingly irradiate the light from the light source onto the measurement target in a line beam shape;
divide light reflected by the measurement target into divided light; and
perform imaging of the divided light; and
an angle-resolved SI optical system configured to:
measure the measurement target using a second scale that is smaller than the first scale;
divide the light from the light source into monochromatic light;
slopingly irradiate the monochromatic light onto the measurement target by using a reflective objective lens; and
perform imaging of light reflected by the measurement target.