US 11,725,974 B2
Systems and methods for liquid-volume measurement in immersion-cooled devices
John H. Bean, Jr., Littlestown, PA (US); and Cory D. Basden, Arnold, MO (US)
Assigned to SCHNEIDER ELECTRIC IT CORPORATION, Foxboro, MA (US)
Filed by SCHNEIDER ELECTRIC IT CORPORATION, Foxboro, MA (US)
Filed on May 23, 2022, as Appl. No. 17/664,434.
Application 17/664,434 is a continuation of application No. 16/930,369, filed on Jul. 16, 2020, granted, now 11,359,955.
Claims priority of provisional application 62/875,998, filed on Jul. 19, 2019.
Prior Publication US 2022/0283014 A1, Sep. 8, 2022
Int. Cl. G01F 23/80 (2022.01); H05K 7/20 (2006.01)
CPC G01F 23/804 (2022.01) [G01F 23/80 (2022.01); H05K 7/20772 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A liquid level sensing system for an immersion cooling system having a device chassis, the liquid level sensing system comprising:
a fluid pump having at least one volumetric flow rate and configured to provide dielectric fluid to the device chassis;
a fluid level sensor configured to sense a height of dielectric fluid in the device chassis; and
at least one controller configured to:
provide a signal to the fluid pump, the signal instructing the fluid pump to provide dielectric fluid at the at least one volumetric flow rate to the device chassis;
receive, at one or more time intervals, one or more height signals indicative of the height of the dielectric fluid in the device chassis from the fluid level sensor; and
generate a map of the dielectric fluid in the device chassis based on the one or more time intervals, the one or more height signals, and the volumetric flow rate.