US 11,725,938 B2
Surveying apparatus, surveying method, and surveying program
You Sasaki, Tokyo (JP)
Assigned to Topcon Corporation, Tokyo (JP)
Filed by Topcon Corporation, Tokyo (JP)
Filed on Jul. 1, 2020, as Appl. No. 16/917,941.
Claims priority of application No. 2019-139536 (JP), filed on Jul. 30, 2019.
Prior Publication US 2021/0033394 A1, Feb. 4, 2021
Int. Cl. G01S 7/481 (2006.01); G01C 15/00 (2006.01); G01C 15/06 (2006.01); G01S 17/42 (2006.01)
CPC G01C 15/006 (2013.01) [G01C 15/06 (2013.01); G01S 7/4817 (2013.01); G01S 17/42 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A surveying apparatus having a combined structure of a total station and a laser scanner, relationships of exterior orientation parameters between the total station and the laser scanner being known in advance, the surveying apparatus comprising a processor or circuitry, the processor or circuitry configured to:
acquire point cloud data that is obtained through laser scanning performed by the surveying apparatus set up at a first instrument point;
acquire a distance to the laser scanner of each point in the point cloud data; and
calculate a location of a second instrument point on a of the distance, and on a basis of,
extraction, from among the point cloud data, 1st to Nth most distant points having distances in directions that are different from each other as viewed from the first instrument point, “N” being a natural number of 2 or more; and
calculation of an average of locations in a horizontal direction of the N number of extracted points.