US 11,725,297 B2
Plating apparatus
Naoki Shimomura, Tokyo (JP); and Mizuki Nagai, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Oct. 18, 2021, as Appl. No. 17/504,127.
Claims priority of application No. 2020-175956 (JP), filed on Oct. 20, 2020.
Prior Publication US 2022/0119981 A1, Apr. 21, 2022
Int. Cl. C25D 17/00 (2006.01); C25D 17/10 (2006.01); C25D 17/02 (2006.01)
CPC C25D 17/10 (2013.01) [C25D 17/007 (2013.01); C25D 17/02 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a substrate holder holding a substrate,
a thief electrode supporter supporting a thief electrode to be disposed outside the substrate,
a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment,
a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and
a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank, wherein
the substrate holder comprises a first arm part supported by the plating tank during the electroplating treatment,
the thief electrode supporter comprises a second arm part supported by the plating tank during the electroplating treatment, and
the transport module transports the substrate holder by holding the first arm part, and transports the thief electrode supporter by holding the second arm part.