CPC C25D 17/10 (2013.01) [C25D 17/007 (2013.01); C25D 17/02 (2013.01)] | 8 Claims |
1. A plating apparatus comprising:
a substrate holder holding a substrate,
a thief electrode supporter supporting a thief electrode to be disposed outside the substrate,
a plating tank configured to immerse the substrate in a plating solution for applying an electroplating treatment,
a thief electrode maintenance tank configured to perform maintenance of the thief electrode, and
a transport module configured to transport the thief electrode supporter to the plating tank and the thief electrode maintenance tank, wherein
the substrate holder comprises a first arm part supported by the plating tank during the electroplating treatment,
the thief electrode supporter comprises a second arm part supported by the plating tank during the electroplating treatment, and
the transport module transports the substrate holder by holding the first arm part, and transports the thief electrode supporter by holding the second arm part.
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