US 11,725,296 B2
Plate, plating apparatus, and method of manufacturing plate
Mitsuhiro Shamoto, Tokyo (JP); Masashi Shimoyama, Tokyo (JP); and Shao Hua Chang, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on May 7, 2021, as Appl. No. 17/314,491.
Claims priority of application No. 2020-083568 (JP), filed on May 12, 2020.
Prior Publication US 2021/0355596 A1, Nov. 18, 2021
Int. Cl. C25D 17/00 (2006.01); C25D 3/02 (2006.01); C25D 17/14 (2006.01); C25D 21/12 (2006.01)
CPC C25D 17/001 (2013.01) [C25D 3/02 (2013.01); C25D 17/008 (2013.01); C25D 17/14 (2013.01); C25D 21/12 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A plating apparatus comprising:
a plating tank,
a substrate holder configured to hold a substrate,
an anode arranged to face the substrate holder, and
a single plate arranged between the substrate holder and the anode in the plating tank, the single plate having a plurality of circular pores on each one of at least three reference circles that are concentric with each other and centered on the single plate and that are different from each other in diameter,
the plurality of circular pores including three circular pores that are arranged respectively on adjacent three of the at least three reference circles and that have centers which are out of alignment with each other on substantially all arbitrary radii on the single plate that are inclusive of circular pores,
wherein the single plate comprises only circular pores that are substantially the same size.