US 11,725,294 B2
Methods for partial gold plating of metal packaging housings and packaging housings thereof
Xiao Ma, Hefei (CN); Lei Yang, Hefei (CN); Huasan Chen, Hefei (CN); Zhengsheng Tang, Hefei (CN); Jin Sun, Hefei (CN); Bo Zhou, Hefei (CN); and Minglong Wang, Hefei (CN)
Assigned to HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD, Hefei (CN)
Filed by HEFEI SHENGDA ELECTRONICS TECHNOLOGY INDUSTRY CO., LTD., Hefei (CN)
Filed on Oct. 21, 2022, as Appl. No. 18/48,510.
Claims priority of application No. 202111492633.5 (CN), filed on Dec. 8, 2021.
Prior Publication US 2023/0175157 A1, Jun. 8, 2023
Int. Cl. C25D 3/14 (2006.01); C25D 3/48 (2006.01); C25D 5/34 (2006.01); C25D 13/18 (2006.01); C25D 5/12 (2006.01); C25D 5/02 (2006.01)
CPC C25D 3/14 (2013.01) [C25D 3/48 (2013.01); C25D 5/02 (2013.01); C25D 5/12 (2013.01); C25D 5/34 (2013.01); C25D 13/18 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method for partial gold plating of a metal packaging housing, wherein the packaging housing includes a base, the base is provided with at least one lead hole, a housing lead is interpenetrated in the at least one lead hole, the at least one lead hole is also provided with an insulator surrounding the housing lead, the method comprising:
S1, nickel plating; powering on the base and the housing lead, and forming a nickel layer by performing nickel plating on the packaging housing as a whole;
S2, oxidation; powering off the housing lead, powering on the base and placing the base in an alkaline solution for oxidation to form an oxide layer on a surface of the nickel layer covering the base;
S3, gold plating; powering off the base, powering on the housing lead, and forming a gold layer on a surface of the housing lead by performing gold plating on the housing lead; and
S4, reduction; placing the packaging housing in a high temperature environment, and obtaining a partial gold-plated packaging housing by reducing the oxide layer on the surface of the nickel layer of the base using a gas mixture of nitrogen and hydrogen.