CPC C25D 3/14 (2013.01) [C25D 3/48 (2013.01); C25D 5/02 (2013.01); C25D 5/12 (2013.01); C25D 5/34 (2013.01); C25D 13/18 (2013.01)] | 15 Claims |
1. A method for partial gold plating of a metal packaging housing, wherein the packaging housing includes a base, the base is provided with at least one lead hole, a housing lead is interpenetrated in the at least one lead hole, the at least one lead hole is also provided with an insulator surrounding the housing lead, the method comprising:
S1, nickel plating; powering on the base and the housing lead, and forming a nickel layer by performing nickel plating on the packaging housing as a whole;
S2, oxidation; powering off the housing lead, powering on the base and placing the base in an alkaline solution for oxidation to form an oxide layer on a surface of the nickel layer covering the base;
S3, gold plating; powering off the base, powering on the housing lead, and forming a gold layer on a surface of the housing lead by performing gold plating on the housing lead; and
S4, reduction; placing the packaging housing in a high temperature environment, and obtaining a partial gold-plated packaging housing by reducing the oxide layer on the surface of the nickel layer of the base using a gas mixture of nitrogen and hydrogen.
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