CPC C23C 16/4583 (2013.01) [C23C 16/0209 (2013.01); C23C 16/0254 (2013.01); C23C 16/45525 (2013.01)] | 10 Claims |
1. A heat shield structure for a substrate support in a substrate processing system, the heat shield structure comprising:
an outer shield configured to surround a stem of the substrate support, wherein the outer shield is further configured to define (i) an inner volume between the outer shield and an upper portion of the stem and a lower surface of the substrate support and (ii) a vertical channel between the outer shield and a lower portion of the stem of the substrate support, wherein the outer shield includes
a cylindrical portion,
a first lateral portion extending radially outward from the cylindrical portion,
an angled portion extending radially outward and upward from the first lateral portion, and
a second lateral portion extending radially outward from the angled portion,
wherein a length of the first lateral portion is between 50% and 70% of a distance between the stem of the substrate support and the outer perimeter of the substrate support, and
wherein a length of the second lateral portion is between 10% and 25% of the distance between the stem of the substrate support and the outer perimeter of the substrate support.
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