US 11,725,273 B2
Electronic device and manufacturing method thereof
Chun-Hao Su, Hsinchu (TW); Chia-Ming Chang, Hsinchu (TW); Chia Wen Dai, Hsinchu (TW); Jiang-Jin You, Hsinchu (TW); Tai-Tso Lin, Hsinchu (TW); and Chun-Nan Lin, Hsinchu (TW)
Assigned to Au Optronics Corporation, Hsinchu (TW)
Filed by Au Optronics Corporation, Hsinchu (TW)
Filed on Nov. 1, 2021, as Appl. No. 17/515,568.
Claims priority of application No. 110114895 (TW), filed on Apr. 26, 2021.
Prior Publication US 2022/0341032 A1, Oct. 27, 2022
Int. Cl. H01L 27/12 (2006.01); C23C 14/54 (2006.01); C23C 14/34 (2006.01)
CPC C23C 14/545 (2013.01) [C23C 14/3492 (2013.01); H01L 27/1244 (2013.01); Y10T 428/12493 (2015.01)] 7 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
an array substrate, comprising:
a substrate, having a substrate surface;
a first conductive layer, located on the substrate surface;
a first insulating layer, located on the first conductive layer;
a second conductive layer, located on the first insulating layer and comprising a first sputtering layer, a second sputtering layer, and a third sputtering layer; and
a second insulating layer, located on the second conductive layer, wherein:
the second sputtering layer is located between the first sputtering layer and the third sputtering layer;
the second sputtering layer comprises a first metal element;
the first sputtering layer comprises the first metal element and a second metal element; and
the third sputtering layer comprises the first metal element and a third metal element,
wherein the array substrate further comprises a semiconductor layer, and the substrate comprises an active area and an inactive area, wherein:
within a range corresponding to the inactive area, at least part of the second conductive layer constitutes a connection pad;
within a range corresponding to the active area, at least part of the first conductive layer, a part of the semiconductor layer, and a part of the second conductive layer constitute an active element; and
within the range corresponding to the inactive area, a part of the second conductive layer is embedded in the first insulating layer to constitute a conducting structure electrically connected to a part of the first conductive layer.