US 11,725,116 B2
CMP composition including a novel abrasive
Alexander W. Hains, Aurora, IL (US); Kim Long, Naperville, IL (US); Steven Grumbine, Aurora, IL (US); Roman A. Ivanov, Aurora, IL (US); Kevin P. Dockery, Aurora, IL (US); Benjamin Petro, St. Charles, IL (US); Brian Sneed, Vernon Hills, IL (US); and Galyna Krylova, Naperville, IL (US)
Assigned to CMC MATERIALS, INC., Aurora, IL (US)
Filed by CMC Materials, Inc., Aurora, IL (US)
Filed on Mar. 30, 2021, as Appl. No. 17/217,097.
Claims priority of provisional application 63/002,743, filed on Mar. 31, 2020.
Prior Publication US 2021/0301178 A1, Sep. 30, 2021
Int. Cl. C09G 1/02 (2006.01); H01L 21/321 (2006.01); C23F 1/26 (2006.01); C23F 11/04 (2006.01)
CPC C09G 1/02 (2013.01) [C23F 1/26 (2013.01); C23F 11/04 (2013.01); H01L 21/3212 (2013.01)] 32 Claims
OG exemplary drawing
 
1. A chemical mechanical polishing composition comprising:
a liquid carrier;
colloidal silica particles dispersed in the liquid carrier, the colloidal silica particles having a positive charge of at least 10 mV in the liquid carrier;
an iron-containing accelerator;
a metal etch inhibitor; and
wherein the colloidal silica particles have (i) a number average aspect ratio of greater than about 1.25 and (ii) a normalized particle size span by weight of greater than about 0.42.