CPC C09G 1/02 (2013.01) [C23F 1/26 (2013.01); C23F 11/04 (2013.01); H01L 21/3212 (2013.01)] | 32 Claims |
1. A chemical mechanical polishing composition comprising:
a liquid carrier;
colloidal silica particles dispersed in the liquid carrier, the colloidal silica particles having a positive charge of at least 10 mV in the liquid carrier;
an iron-containing accelerator;
a metal etch inhibitor; and
wherein the colloidal silica particles have (i) a number average aspect ratio of greater than about 1.25 and (ii) a normalized particle size span by weight of greater than about 0.42.
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