US 11,724,355 B2
Substrate polish edge uniformity control with secondary fluid dispense
Justin H. Wong, Pleasanton, CA (US); and Kevin H. Song, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Sep. 30, 2020, as Appl. No. 17/38,793.
Prior Publication US 2022/0097198 A1, Mar. 31, 2022
Int. Cl. B24B 37/015 (2012.01); B24B 37/10 (2012.01); B24B 57/02 (2006.01); B24B 37/013 (2012.01); B24B 49/12 (2006.01); B24B 37/20 (2012.01); B24B 37/32 (2012.01)
CPC B24B 37/013 (2013.01) [B24B 37/015 (2013.01); B24B 37/105 (2013.01); B24B 37/205 (2013.01); B24B 49/12 (2013.01); B24B 57/02 (2013.01); B24B 37/32 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for processing a substrate, comprising:
a pad disposed on a platen, wherein the pad has a pad radius and a central axis from which the pad radius extends;
a carrier assembly configured to be disposed on a surface of the pad and having a carrier radius that extends from a rotational axis of the carrier assembly, wherein the rotational axis is disposed at a first radial distance from the central axis;
a first fluid delivery arm having a first nozzle configured to provide a first fluid to a first point on the pad at a second radial distance from the central axis;
a second fluid delivery arm having a second nozzle configured to provide a second fluid to a second point on the pad, the second point disposed a third radial distance from the central axis, wherein the second radial distance is less than the first radial distance, and the third radial distance is greater than or equal to the second radial distance; and
a controller adapted to synchronize a movement of the second fluid delivery arm with a movement of the carrier assembly to cause the second fluid provided to the second point on the pad to have a consistent radial entry point under the carrier assembly.