US 11,724,352 B2
Wafer processing method
Toshiyuki Sakai, Tokyo (JP); and Heidi Lan, Tokyo (JP)
Assigned to DISCO CORPORATION, Tokyo (JP)
Filed by DISCO CORPORATION, Tokyo (JP)
Filed on Apr. 29, 2021, as Appl. No. 17/243,850.
Claims priority of application No. 2020-096011 (JP), filed on Jun. 2, 2020.
Prior Publication US 2021/0370460 A1, Dec. 2, 2021
Int. Cl. B24B 7/22 (2006.01); H01L 21/66 (2006.01); H01L 21/683 (2006.01); H01L 21/304 (2006.01)
CPC B24B 7/228 (2013.01) [H01L 21/304 (2013.01); H01L 21/6836 (2013.01); H01L 22/26 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68327 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A protective component sticking apparatus that sticks a protective component to a front surface side of a wafer including devices on the front surface side, the protective component sticking apparatus comprising:
a protective component forming unit configured for forming the protective component sheet separate from the wafer, wherein the protective component forming unit forms the protective component sheet with a sheet of a single-wafer system by pressing a thermoplastic resin pellet while heating the thermoplastic resin;
a protective component sticking unit that has a support table and a pressing body and attaches the protective component sheet to the wafer through sticking the protective component sheet formed of a resin that softens by heat to the front surface side of the wafer by pressing the protective component sheet against the front surface side of the wafer while heating the protective component sheet with use of the pressing body and the support table;
a thickness measuring unit that has a thickness measuring instrument and measures a thickness of the protective component sheet in the wafer with the protective component sheet; and
a transmitting part for transmitting information on the thickness of the protective component sheet measured by the thickness measuring unit to an external of the protective component sticking apparatus.