US 11,724,341 B2
Lead-free solder alloy, solder joining material, electronic circuit mounting substrate, and electronic control device
Yurika Munekawa, Iruma (JP); Takeshi Nakano, Iruma (JP); Masaya Arai, Iruma (JP); Takanori Shimazaki, Iruma (JP); and Tsukasa Katsuyama, Iruma (JP)
Assigned to TAMURA CORPORATION, Tokyo (JP)
Filed by TAMURA CORPORATION, Tokyo (JP)
Filed on Sep. 16, 2020, as Appl. No. 17/22,090.
Application 17/022,090 is a continuation of application No. PCT/JP2019/048406, filed on Dec. 11, 2019.
Claims priority of application No. 2018-240674 (JP), filed on Dec. 25, 2018.
Prior Publication US 2021/0001433 A1, Jan. 7, 2021
Int. Cl. B23K 35/26 (2006.01); H05K 3/34 (2006.01); H01L 23/00 (2006.01)
CPC B23K 35/262 (2013.01) [H01L 24/13 (2013.01); H05K 3/3485 (2020.08); H01L 2924/014 (2013.01)] 7 Claims
OG exemplary drawing
 
1. A lead-free solder alloy for an on-vehicle electronic circuit mounting substrate comprising:
2.0% by mass or more and 4.0% by mass or less of Ag;
0.3% by mass or more and 0.7% by mass or less of Cu;
1.7% by mass or more and 2.0% by mass or less of Bi;
0.5% by mass or more and 2.1% by mass or less of In;
3.0% by mass or more and 4.0% by mass or less of Sb;
0.001% by mass or more and 0.05% by mass or less of Ni;
0.001% by mass or more and 0.01% by mass or less of Co;
optionally further comprising at least one of P, Ga, and Ge in a total amount of 0.001% by mass or more and 0.05% by mass or less;
optionally further comprising at least one of Fe, Mn, Cr, and Mo in a total amount of 0.001% by mass or more and 0.05% by mass or less; and
the balance being Sn.