CPC B23K 35/262 (2013.01) [H01L 24/13 (2013.01); H05K 3/3485 (2020.08); H01L 2924/014 (2013.01)] | 7 Claims |
1. A lead-free solder alloy for an on-vehicle electronic circuit mounting substrate comprising:
2.0% by mass or more and 4.0% by mass or less of Ag;
0.3% by mass or more and 0.7% by mass or less of Cu;
1.7% by mass or more and 2.0% by mass or less of Bi;
0.5% by mass or more and 2.1% by mass or less of In;
3.0% by mass or more and 4.0% by mass or less of Sb;
0.001% by mass or more and 0.05% by mass or less of Ni;
0.001% by mass or more and 0.01% by mass or less of Co;
optionally further comprising at least one of P, Ga, and Ge in a total amount of 0.001% by mass or more and 0.05% by mass or less;
optionally further comprising at least one of Fe, Mn, Cr, and Mo in a total amount of 0.001% by mass or more and 0.05% by mass or less; and
the balance being Sn.
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