CPC B23K 1/06 (2013.01) [B05B 17/0661 (2013.01); B05B 17/0669 (2013.01); B23K 3/08 (2013.01)] | 6 Claims |
1. A method for liquid spray soldering is characterized in that it is comprised of the following steps:
S1: a solder to be spray-soldered is melted under a protection of an inert gas to obtain a melted solder;
S2: then, the melted solder is spray-soldered using ultrasonic focusing thus producing a sprayed solder;
S3: the sprayed solder enters an oxygen barrier area, and is spray-soldered under the oxygen barrier area with sonic waves to solder devices with solder joints;
to perform the steps, a device for liquid spray soldering is used, including:
a solder conversion mechanism that has the solder to be spray-soldered to melt and consists of a container (1); where a cavity (101) in the container (1) is used for placing solder materials; a spraying hole (102) is arranged at the bottom of the container (1) to connect with the cavity (101), and a heating mechanism (2) used for melting solder is mounted along an outer wall of the container (1);
a device for driving the solder while being sprayed is equipped with an ultrasonic generating mechanism (4), and an ultrasonic controlling mechanism (6) for controlling the ultrasonic frequency in the ultrasonic generating mechanism (4); one of these mechanisms extends into the cavity (101) and is immersed in an ultrasonic focusing mechanism (3) which focuses the ultrasound (3) in the liquid solder, the ultrasonic focusing mechanism (3) includes an ultrasonic focusing device (301) for focusing ultrasonic waves at the spraying hole (102);
along the spraying path of the solder, an oxygen barrier mechanism (7) is provided on both sides of the spraying path; the oxygen barrier mechanism (7) includes mechanisms that generate and strengthen sound waves for enhancing the sonic waves produced in a sonic wave generating mechanism and for applying the strengthened effects of sonic waves around the spraying hole (102).
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