Yung Tseng Chen, San Francisco, CA (US); Thomas Crisp, Cottonwood Heights, UT (US); Francois Laine, Walnut Creek, CA (US); H. William Smith, South Jordan, UT (US); and Kenneth Sweet, South Jordan, UT (US)
Assigned to Cricut, Inc., South Jordan, UT (US)
Filed by Cricut, Inc., South Jordan, UT (US)
Filed on Mar. 4, 2022, as Appl. No. 29/792,126.
Term of patent 15 Years
LOC (14) Cl. 15 - 09
U.S. Cl. D15—144
The ornamental design for a heat press pad, as shown and described.
