US 11,723,222 B2
Integrated circuit (IC) package with integrated inductor having core magnetic field (B field) extending parallel to substrate
Yaojian Leng, Portland, OR (US); Justin Sato, West Linn, OR (US); and Bomy Chen, Newark, CA (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Oct. 20, 2020, as Appl. No. 17/74,848.
Application 17/074,848 is a continuation in part of application No. 16/540,117, filed on Aug. 14, 2019, granted, now 11,043,471.
Claims priority of provisional application 62/845,833, filed on May 9, 2019.
Claims priority of provisional application 63/007,872, filed on Apr. 9, 2020.
Prior Publication US 2021/0036059 A1, Feb. 4, 2021
Int. Cl. H10K 19/00 (2023.01); H10K 19/10 (2023.01); H01L 49/02 (2006.01)
CPC H10K 19/201 (2023.02) [H10K 19/10 (2023.02); H01L 28/10 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An integrated circuit (IC) package, comprising:
an IC package substrate having a horizontal IC package substrate major plane;
a die mount base arranged on the IC package substrate and having a horizontal die mount base substrate major plane parallel to the horizontal IC package substrate major plane;
a vertically-mounted die (VMD) mounted to the die mount base in a vertical orientation, the VMD comprising a VMD die substrate having a vertical die substrate major plane; and
an integrated inductor having a core magnetic field (B field) extending parallel to at least one of (a) the IC package substrate major plane and (b) the VMD die substrate major plane.