US 11,723,183 B2
Electronic component evaluation method, electronic component evaluation device, and electronic component evaluation program
Junji Morita, Natori (JP); and Daichi Gemba, Natori (JP)
Assigned to SUMIDA CORPORATION
Filed by SUMIDA CORPORATION, Tokyo (JP)
Filed on Apr. 29, 2020, as Appl. No. 16/861,552.
Claims priority of application No. 2019-089685 (JP), filed on May 10, 2019.
Prior Publication US 2020/0359537 A1, Nov. 12, 2020
Int. Cl. G06K 9/00 (2022.01); H05K 13/08 (2006.01); G06T 7/70 (2017.01); H05K 13/04 (2006.01); G06T 7/00 (2017.01); G06T 7/60 (2017.01); G01B 11/14 (2006.01); G01N 21/95 (2006.01); G01N 21/956 (2006.01)
CPC H05K 13/0812 (2018.08) [G01B 11/14 (2013.01); G01N 21/9501 (2013.01); G06T 7/0004 (2013.01); G06T 7/60 (2013.01); G06T 7/70 (2017.01); H05K 13/0409 (2018.08); G01N 2021/95661 (2013.01); G06T 2207/30141 (2013.01); G06T 2207/30164 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An electronic component evaluation method for causing a processor to execute computer-readable instructions stored in a memory with respect to an electronic component, the electronic component having:
an upper surface;
a lower base part including a lower surface facing a mounting substrate, the lower surface being outwardly opposite to the upper surface, the lower surface having four outermost corners, the four outermost corners having first, second, third, and fourth measuring points, respectively; and
a plurality of mounting terminals configured to be mounted on the mounting substrate, the plurality of mounting terminals being laterally shifted from the lower surface of the lower base part, the first, second, third, and fourth measuring points being located closer to a center point of the lower surface than the plurality of mounting terminals in a plan view, wherein the electronic component is placed on an evaluation plate in a state in which the upper surface is on the evaluation plate and the lower surface faces upward;
the method comprising executing on the processor the steps of:
obtaining terminal position information of the plurality of mounting terminals;
generating a reference plane including at least three of the plurality of mounting terminals utilizing the terminal position information;
capturing an image of the first, second, third, and fourth measuring points on the lower surface of the lower base part of the electronic component;
obtaining image data from the captured image;
obtaining lower base part position information of the first, second, third, and fourth measuring points on the lower surface of the lower base part in response to the image data;
detecting height information of heights of at least two points of the first, second, third, and fourth measuring points with respect to the reference plane;
obtaining a degree of inclination of the lower surface relative to the reference plane based on the height information; and
evaluating the electronic component by comparing the obtained degree of inclination with a predetermined range.