US 11,723,177 B2
Cooling device with fiber attachment between heating tube and cooling element
Thomas Bigl, Herzogenaurach (DE); Alexander Hensler, Gerhardshofen (DE); Stephan Neugebauer, Erlangen (DE); Ewgenij Ochs, Fürth (DE); Philipp Oschmann, Erlangen (DE); Stefan Pfefferlein, Heroldsberg (DE); and Ulrich Wetzel, Adelsdorf (DE)
Assigned to Siemens Aktiengesellschaft, Munich (DE)
Appl. No. 17/290,587
Filed by SIEMENS AKTIENGESELLSCHAFT, Munich (DE)
PCT Filed Oct. 31, 2019, PCT No. PCT/EP2019/079796
§ 371(c)(1), (2) Date Apr. 30, 2021,
PCT Pub. No. WO2020/089377, PCT Pub. Date May 7, 2020.
Claims priority of application No. 18204081 (EP), filed on Nov. 2, 2018.
Prior Publication US 2022/0007543 A1, Jan. 6, 2022
Int. Cl. H05K 7/20 (2006.01); F28F 21/08 (2006.01); H01L 23/373 (2006.01); H01L 23/427 (2006.01)
CPC H05K 7/20445 (2013.01) [F28F 21/085 (2013.01); H05K 7/20336 (2013.01); H05K 7/20409 (2013.01); H05K 7/20936 (2013.01); H01L 23/373 (2013.01); H01L 23/427 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A cooling device for heat dissipation from an electronic component, said cooling device, comprising
a heating tube having a heating tube surface;
a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube;
a first fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess; and
a second fiber structure made from fibers and arranged on a cooling element surface in the region of the slot recess, said fibers on the heating tube surface of the heating tube forming in the region of the slot recess a mechanical connection with the fibers on the cooling element surface of the cooling element.