CPC H05K 7/20445 (2013.01) [F28F 21/085 (2013.01); H05K 7/20336 (2013.01); H05K 7/20409 (2013.01); H05K 7/20936 (2013.01); H01L 23/373 (2013.01); H01L 23/427 (2013.01)] | 15 Claims |
1. A cooling device for heat dissipation from an electronic component, said cooling device, comprising
a heating tube having a heating tube surface;
a cooling element having a first cooling element side formed with a slot recess which at least partially encloses the heating tube;
a first fiber structure made of fibers and arranged on the heating tube surface in a region in which the heating tube is at least partially enclosed by the slot recess; and
a second fiber structure made from fibers and arranged on a cooling element surface in the region of the slot recess, said fibers on the heating tube surface of the heating tube forming in the region of the slot recess a mechanical connection with the fibers on the cooling element surface of the cooling element.
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