US 11,723,169 B2
Electronic apparatus
Cuicui Wang, Beijing (CN); and Ying Sun, Beijing (CN)
Assigned to LENOVO (BEIJING) LIMITED, Beijing (CN)
Filed by Lenovo (Beijing) Limited, Beijing (CN)
Filed on Dec. 14, 2021, as Appl. No. 17/550,287.
Claims priority of application No. 202110319872.4 (CN), filed on Mar. 25, 2021.
Prior Publication US 2022/0312634 A1, Sep. 29, 2022
Int. Cl. H05K 7/20 (2006.01)
CPC H05K 7/20154 (2013.01) [H05K 7/20172 (2013.01); H05K 7/20409 (2013.01)] 9 Claims
OG exemplary drawing
 
1. An electronic apparatus comprising:
a cylindrical housing including an air inlet structure and an air outlet structure;
a first functional member and a second functional member arranged in the cylindrical housing, the first functional member and the second functional member being alternately arranged; and
a heat dissipation assembly arranged in the cylindrical housing, and including:
a heat sink set including a plurality of heat sink fins to enlarge a heat dissipation area; and
a plurality of heat pipe sets arranged through the heat sink set, each of the first functional member and the second functional member being correspondingly in contact with at least one heat pipe set to transfer heat, heat of each of the first functional member and the second functional member being transferred to the heat dissipation set through the corresponding heat pipe set;
wherein the first functional member and the second functional member are thermally connected to two heat transfer contact surfaces of the heat dissipation assembly, respectively, and the heat dissipation assembly is configured to perform heat dissipation processing on the first functional member and the second functional member.