CPC H05K 3/325 (2013.01) [H01L 21/60 (2021.08); H01L 23/12 (2013.01); H05K 1/111 (2013.01)] | 15 Claims |
1. An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
the wiring board including a wire contact pad;
an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
an isolation ball contacting the pressure end;
a clamp disc contacting the isolation ball opposite the pressure end and above the wire contact pad; and
an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture sized to accept the pressure end, the isolation ball, and the clamp disc, the insulating guidance housing positioned above the wire contact pad;
the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the clamp disc.
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