US 11,723,154 B1
Multiwire plate-enclosed ball-isolated single-substrate silicon-carbide-die package
Nicholas J. Chiolino, Springdale, AR (US); A. Matthew Francis, Elkins, AR (US); Matthew W. Barlow, Springdale, AR (US); and Jacob Kupernik, Bella Vista, AR (US)
Filed by Nicholas J. Chiolino, Springdale, AR (US); A. Matthew Francis, Elkins, AR (US); Matthew W. Barlow, Springdale, AR (US); and Jacob Kupernik, Bella Vista, AR (US)
Filed on Feb. 16, 2021, as Appl. No. 17/176,338.
Claims priority of provisional application 62/977,585, filed on Feb. 17, 2020.
Int. Cl. H05K 3/32 (2006.01); H01L 21/60 (2006.01); H05K 1/11 (2006.01); H01L 23/12 (2006.01)
CPC H05K 3/325 (2013.01) [H01L 21/60 (2021.08); H01L 23/12 (2013.01); H05K 1/111 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electrical circuit packaging apparatus for connecting a wire with a wire end to a package die, the electrical circuit packaging apparatus comprising:
an enclosure top plate connected to an enclosure bottom plate with a wiring board captured between the enclosure top plate and the enclosure bottom plate;
the wiring board including a wire contact pad;
an adjustable clamping pressure extension connected to the enclosure top plate, the adjustable clamping pressure extension including a pressure end;
an isolation ball contacting the pressure end;
a clamp disc contacting the isolation ball opposite the pressure end and above the wire contact pad; and
an insulating guidance housing with a housing body including an outer housing wall defining a vertical through aperture sized to accept the pressure end, the isolation ball, and the clamp disc, the insulating guidance housing positioned above the wire contact pad;
the housing body further defining a side wire aperture to position the wire end between the wire contact pad and the clamp disc.