US 11,723,151 B2
Methods of creating exposed cavities in molded electronic devices
Dongkai Shangguan, San Jose, CA (US); David Geiger, Dublin, CA (US); Venkat Iyer, Cupertino, CA (US); and Cheng Yang, Pudong New Area (CN)
Assigned to FLEX LTD, Singapore (SG)
Filed by FLEX LTD, Singapore (SG)
Filed on Apr. 12, 2022, as Appl. No. 17/719,348.
Application 17/719,348 is a continuation of application No. 16/709,743, filed on Dec. 10, 2019, granted, now 11,304,302, issued on Apr. 12, 2022.
Claims priority of application No. 201910919566.7 (CN), filed on Sep. 26, 2019.
Prior Publication US 2022/0330435 A1, Oct. 13, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H05K 3/00 (2006.01); H05K 3/28 (2006.01)
CPC H05K 3/0044 (2013.01) [H05K 3/0026 (2013.01); H05K 3/284 (2013.01); H05K 2203/025 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
assembling at least one electronic device with a sensor or an emitter;
placing a cover over the sensor or the emitter;
placing the electronic device into a mold cavity of a transfer mold, wherein the mold cavity has a height substantially identical to a height of the cover;
encapsulating the electronic device with an encapsulant, yielding an encapsulated electronic device;
removing the encapsulated electronic device from the transfer mold;
placing the encapsulated electronic device in a milling machine;
determining a position of the sensor or the emitter; and
milling a top portion of the cover to expose the sensor or the emitter based on the position of the sensor or the emitter.