CPC H05K 1/0209 (2013.01) [H05K 2201/0364 (2013.01); H05K 2201/062 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10318 (2013.01)] | 20 Claims |
1. A system comprising:
a package comprising:
a circuit substrate comprising:
a dielectric layer;
a first metal layer disposed upon a first side of the dielectric layer and having a first external surface; and
a plurality of metal posts disposed on the first external surface comprising:
a merged set of at least two metal posts configured to block interfering signals between a first signal pin and a second signal pin and to dissipate heat from the circuit substrate; and
a mounting set of metal posts configured to mount the package.
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