US 11,723,143 B1
Thermal dissipation and shielding improvement using merged PCB bottom copper post
Chang Kyu Choi, Fremont, CA (US); Hyun Mo Ku, Seoul (KR); Sarah Kay Haney, San Jose, CA (US); and Li Sun, San Jose, CA (US)
Assigned to Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed by Avago Technologies International Sales Pte. Limited, Singapore (SG)
Filed on Apr. 27, 2022, as Appl. No. 17/730,856.
Int. Cl. H05K 1/02 (2006.01)
CPC H05K 1/0209 (2013.01) [H05K 2201/0364 (2013.01); H05K 2201/062 (2013.01); H05K 2201/094 (2013.01); H05K 2201/09418 (2013.01); H05K 2201/10098 (2013.01); H05K 2201/10318 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A system comprising:
a package comprising:
a circuit substrate comprising:
a dielectric layer;
a first metal layer disposed upon a first side of the dielectric layer and having a first external surface; and
a plurality of metal posts disposed on the first external surface comprising:
a merged set of at least two metal posts configured to block interfering signals between a first signal pin and a second signal pin and to dissipate heat from the circuit substrate; and
a mounting set of metal posts configured to mount the package.