US 11,722,957 B2
Method and apparatus for thermal management in wireless communication
Hyunseok Yu, Seoul (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 29, 2021, as Appl. No. 17/564,705.
Application 17/564,705 is a continuation of application No. 16/838,453, filed on Apr. 2, 2020, granted, now 11,246,093.
Claims priority of application No. 10-2019-0043297 (KR), filed on Apr. 12, 2019; and application No. 10-2019-0089208 (KR), filed on Jul. 23, 2019.
Prior Publication US 2022/0124616 A1, Apr. 21, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04W 52/02 (2009.01); H04M 1/02 (2006.01)
CPC H04W 52/0225 (2013.01) [H04M 1/0279 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A signal processing device configured to process a baseband signal for wireless communication, the signal processing device comprising:
a plurality of temperature sensors associated with respective ones of a plurality of internal functional blocks of the signal processing device such that the plurality of temperature sensors are configured to sense a plurality of internal temperatures each associated with a respective one of the plurality of internal functional blocks of the signal processing device;
a storage device configured to store a plurality of thresholds defining a plurality of temperature ranges; and
a controller configured to,
estimate a surface temperature based on an artificial neural network trained according to training data including the plurality of internal temperatures and surface temperatures, and
selectively perform at least one thermal mitigation operation based on the surface temperature and the plurality of temperature ranges.