CPC H04N 25/75 (2023.01) [H01L 23/481 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14607 (2013.01); H01L 27/14612 (2013.01); H01L 27/14625 (2013.01); H01L 27/14627 (2013.01); H01L 27/14632 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14638 (2013.01); H01L 27/14643 (2013.01); H01L 27/14689 (2013.01); H04N 23/54 (2023.01); H04N 25/76 (2023.01); H04N 25/79 (2023.01); H01L 29/788 (2013.01); H01L 29/792 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/0557 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/13 (2013.01); H01L 2224/13025 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1425 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1443 (2013.01); H10B 69/00 (2023.02)] | 9 Claims |
1. An image sensor comprising:
a first semiconductor chip having an image sensor including pixels, each of the pixels including a photoelectric conversion element and transistors; and
a second semiconductor chip including analog/digital converters,
wherein the first semiconductor chip and the second semiconductor chip are stacked and electrically connected to each other.
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