US 11,722,097 B2
Integrated circuit device and oscillator
Tomohiro Uno, Chino (JP)
Assigned to SEIKO EPSON CORPORATION, Tokyo (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Mar. 9, 2022, as Appl. No. 17/690,436.
Claims priority of application No. 2021-038949 (JP), filed on Mar. 11, 2021.
Prior Publication US 2022/0294391 A1, Sep. 15, 2022
Int. Cl. H03B 5/04 (2006.01); H03B 5/36 (2006.01)
CPC H03B 5/04 (2013.01) [H03B 5/364 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An integrated circuit device comprising:
a heat generating circuit controlled based on a temperature control signal, wherein
the heat generating circuit includes a heat generating transistor including a plurality of transistors that have a gate voltage controlled based on the temperature control signal and are coupled in parallel,
a resistance value of a source resistance of the heat generating transistor is smaller than a resistance value of a drain resistance of the heat generating transistor,
the integrated circuit device has an outer shape including a first side and a second side facing the first side,
a ground pad that is electrically coupled to a source of the heat generating transistor is arranged along the first side,
a power supply pad that supplies a power supply voltage to a drain of the heat generating transistor is arranged along the second side, and
the heat generating transistor is arranged between the ground pad and the power supply pad such that an entirety of the plurality of transistors are disposed between the ground pad and the power supply pad.