US 11,722,096 B2
Oven controlled MEMS oscillator with multiple temperature control loops
Bichoy Bahr, Allen, TX (US); Baher Haroun, Allen, TX (US); Swaminathan Sankaran, Allen, TX (US); Argyrios Dellis, McKinney, TX (US); and Sachin Kalia, Dallas, TX (US)
Assigned to Texas Instruments Incorporated, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Sep. 30, 2021, as Appl. No. 17/490,223.
Prior Publication US 2023/0094448 A1, Mar. 30, 2023
Int. Cl. H03L 1/04 (2006.01); H03H 9/08 (2006.01); H03B 1/02 (2006.01); H05B 3/06 (2006.01); H05B 1/02 (2006.01); H03B 5/32 (2006.01); H03L 1/02 (2006.01); H03H 9/05 (2006.01)
CPC H03B 1/02 (2013.01) [H03B 5/326 (2013.01); H03H 9/0504 (2013.01); H03H 9/08 (2013.01); H03L 1/028 (2013.01); H03L 1/04 (2013.01); H05B 1/023 (2013.01); H05B 3/06 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A system, comprising:
a bulk acoustic wave (BAW) resonator;
a BAW die;
a first heater configured to heat the BAW resonator, wherein the first heater is controlled by a first control loop;
a circuit coupled to the BAW resonator; and
a second heater configured to heat the circuit, wherein the second heater is controlled by a second control loop,
wherein the BAW resonator and the first heater are directly coupled to each other and anchored to a portion of the BAW die such that the BAW resonator is spaced from the BAW die and the first heater partially encloses the BAW die.