US 11,721,913 B2
Chip antenna module
Jae Yeong Kim, Suwon-si (KR); Sung Nam Cho, Suwon-si (KR); Ju Hyoung Park, Suwon-si (KR); Jeong Ki Ryoo, Suwon-si (KR); Kyu Bum Han, Suwon-si (KR); and Sung Yong An, Suwon-si (KR)
Assigned to Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electro-Mechanics Co., Ltd., Suwon-si (KR)
Filed on Aug. 11, 2021, as Appl. No. 17/399,572.
Application 17/399,572 is a continuation of application No. 16/725,377, filed on Dec. 23, 2019, granted, now 11,121,476.
Claims priority of application No. 10-2019-0015000 (KR), filed on Feb. 8, 2019; and application No. 10-2019-0081510 (KR), filed on Jul. 5, 2019.
Prior Publication US 2021/0376490 A1, Dec. 2, 2021
Int. Cl. H01Q 21/06 (2006.01); H01Q 19/10 (2006.01); H01Q 1/48 (2006.01); H01Q 1/22 (2006.01)
CPC H01Q 21/065 (2013.01) [H01Q 1/2283 (2013.01); H01Q 1/48 (2013.01); H01Q 19/10 (2013.01)] 23 Claims
OG exemplary drawing
 
1. A chip antenna module comprising:
a substrate comprising an upper surface pad disposed on a first surface of the substrate and a feed pad disposed on the first surface of the substrate;
a chip antenna configured to transmit a radio-frequency signal, electrically connected to the feed pad, and bonded to the upper surface pad; and
an electronic element mounted on a second surface of the substrate,
wherein the chip antenna comprises:
a first ceramic substrate bonded to the upper surface pad;
a second ceramic substrate opposing the first ceramic substrate;
a first patch disposed on the first ceramic substrate; and
a second patch disposed on the second ceramic substrate, and
the first ceramic substrate and the second ceramic substrate are spaced apart from each other.