US 11,721,899 B2
Front-end modules with ground plane slots
Chin-Hung Ma, Taipei (TW); Chien-Pai Lai, Taipei (TW); and Chih Hung Chien, Taipei (TW)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Filed by HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., Spring, TX (US)
Filed on May 19, 2022, as Appl. No. 17/748,835.
Application 17/748,835 is a continuation of application No. 16/978,723, granted, now 11,367,957, previously published as PCT/US2018/036370, filed on Jun. 7, 2018.
Prior Publication US 2022/0278454 A1, Sep. 1, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 21/00 (2006.01); H01Q 5/40 (2015.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H01Q 1/48 (2006.01); H01Q 13/10 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 5/40 (2015.01) [H01Q 1/2258 (2013.01); H01Q 1/2283 (2013.01); H01Q 1/241 (2013.01); H01Q 1/48 (2013.01); H01Q 13/10 (2013.01); H01Q 21/065 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a substrate including a ground plane;
an antenna on the substrate, the antenna to operate at a first resonant frequency in a wireless communication network; and
a slot defined in the ground plane, the slot to provide a second resonant frequency in the wireless communication network,
wherein the second resonant frequency is lower than the first resonant frequency.