US 11,721,882 B2
Semiconductor package having discrete antenna device
Fu-Yi Han, Taichung (TW); Che-Ya Chou, Kaohsiung (TW); Che-Hung Kuo, Tainan (TW); Wen-Chou Wu, Hsinchu (TW); Nan-Cheng Chen, Hsin-Chu (TW); Min-Chen Lin, Hsin-Chu (TW); and Hsing-Chih Liu, Taichung (TW)
Assigned to MediaTek Inc., Hsin-Chu (TW)
Filed by MediaTek Inc., Hsin-Chu (TW)
Filed on Oct. 20, 2020, as Appl. No. 17/75,561.
Application 17/075,561 is a continuation of application No. 15/974,700, filed on May 9, 2018, granted, now 10,847,869.
Claims priority of provisional application 62/584,155, filed on Nov. 10, 2017.
Claims priority of provisional application 62/579,947, filed on Nov. 1, 2017.
Claims priority of provisional application 62/516,150, filed on Jun. 7, 2017.
Prior Publication US 2021/0036405 A1, Feb. 4, 2021
Int. Cl. H01Q 1/22 (2006.01); H01L 23/66 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01)
CPC H01Q 1/2283 (2013.01) [H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/20 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13144 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16141 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/48227 (2013.01); H01L 2225/1023 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/15321 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19106 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A semiconductor package, comprising:
a bottom chip package having a first side and a second side opposing the first side, the bottom chip package comprising a package substrate having a core with at least one plated through-hole, and at least one build-up layer;
a semiconductor chip on the first side or the second side of the bottom chip package;
a discrete antenna device mounted on the first side of the bottom chip package and having a first radiative antenna element; and
conductive elements between the discrete antenna device and the bottom chip package to electrically interconnect the bottom chip package and the discrete antenna device.