US 11,721,796 B2
LED displays fabricated using hybrid bonding
Henry Choy, Saratoga, CA (US); and Paul Martin, Saratoga, CA (US)
Assigned to TECTUS CORPORATION, Saratoga, CA (US)
Filed by TECTUS CORPORATION, Saratoga, CA (US)
Filed on Mar. 29, 2021, as Appl. No. 17/215,767.
Prior Publication US 2022/0310892 A1, Sep. 29, 2022
Int. Cl. H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 33/32 (2010.01)
CPC H01L 33/62 (2013.01) [H01L 25/0753 (2013.01); H01L 33/505 (2013.01); H01L 33/32 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0066 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A method of making a high-density light emitting diode (LED) display comprising:
depositing a dielectric region overlying a transparent electrically conductive region of an integrated LED array, wherein,
a first portion of the transparent electrically conductive region overlies each of the LEDs and a second portion of the transparent electrically conductive region overlies a metal region; and
a first portion of the dielectric region overlies the first portion of the transparent electrically conductive region and the second portion of the transparent electrically conductive region;
etching the second portion of the dielectric region to expose the transparent electrically conductive region;
depositing a reflective metal region overlying the first portion of the dielectric region and overlying the exposed transparent electrically conductive region;
depositing a metal region overlying the reflective metal region;
planarizing the metal region to expose the first portion of the dielectric region;
etching the first portion of the dielectric region to expose the first portion of the transparent electrically conductive region to provide a cavity overlying each LED; and
filling each of the cavities with a color conversion material to provide a color conversion pixel overlying each of the LEDs.