CPC H01L 33/483 (2013.01) [H01L 24/95 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 25/50 (2013.01); H01L 33/20 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 33/62 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83143 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83488 (2013.01); H01L 2224/83805 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/95001 (2013.01); H01L 2224/95085 (2013.01); H01L 2224/95101 (2013.01); H01L 2224/95136 (2013.01); H01L 2224/95146 (2013.01); H01L 2224/97 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/15153 (2013.01); H01L 2924/15155 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0066 (2013.01)] | 22 Claims |
1. A device, the device comprising:
a substrate assembly including a first material layer disposed over and mechanically bonded to a second material layer, wherein the substrate assembly includes at least a first opening and a second opening; wherein at least one of the first opening or the second opening does not extend into the second material layer; wherein the first opening is configured to accept a light emitting diode of a first size, but not a light emitting diode of a second size; wherein the second opening is configured to accept the light emitting diode of the second size.
|