US 11,721,788 B2
Method of bonding a semiconductor device to a support substrate
Quanbo Zou, Pleasanton, CA (US); Salman Akram, Boise, ID (US); and Jerome Chandra Bhat, San Jose, CA (US)
Assigned to Lumileds LLC, San Jose, CA (US)
Filed by Lumileds LLC, San Jose, CA (US)
Filed on May 6, 2016, as Appl. No. 15/148,135.
Application 15/148,135 is a continuation of application No. 14/131,207, granted, now 9,343,612, issued on May 17, 2016, previously published as PCT/IB2012/053513, filed on Jul. 10, 2012.
Claims priority of provisional application 61/614,578, filed on Mar. 23, 2012.
Claims priority of provisional application 61/508,211, filed on Jul. 15, 2011.
Prior Publication US 2016/0247969 A1, Aug. 25, 2016
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 33/00 (2010.01); H01L 33/46 (2010.01); H01L 33/06 (2010.01); H01L 33/12 (2010.01); H01L 33/32 (2010.01); H01L 33/38 (2010.01); H01L 33/62 (2010.01)
CPC H01L 33/12 (2013.01) [H01L 33/005 (2013.01); H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 33/06 (2013.01); H01L 33/32 (2013.01); H01L 33/38 (2013.01); H01L 33/46 (2013.01); H01L 33/62 (2013.01); H01L 2224/16 (2013.01); H01L 2924/1461 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0066 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A method comprising:
providing a wafer comprising light-emitting devices on a growth substrate, the wafer comprising a first surface and a second surface opposite the first surface, the first surface comprising at least portions of the light-emitting devices and the second surface being a surface of the growth substrate;
bonding the first surface of the wafer to a support wafer at a first above room temperature bonding temperature;
bonding the second surface of the wafer to a stress-compensating wafer at a second above room temperature bonding temperature to form a bonded stack comprising the wafer, the support wafer and the stress-compensating wafer, the support wafer and the stress-compensating wafer having the same thickness and being formed from the same material; and
allowing the bonded stack to cool to room temperature.