CPC H01L 33/0095 (2013.01) [H01L 33/0093 (2020.05)] | 5 Claims |
1. A method of manufacturing a display device, comprising:
providing a substrate;
providing a light emitting unit having a chip and at least one bonding pin;
mounting the light emitting unit on the substrate through the at least one bonding pin;
applying an adhesive material to a space between the chip and the substrate after mounting the light emitting unit on the substrate, wherein the adhesive material is applied by:
attaching a sheet of the adhesive material in a solid state on the light emitting unit and
converting the sheet from the solid state into a fluid state, thereby flowing into the space between the chip and the substrate; and
providing an external vacuum to let the adhesive material fill the space.
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