US 11,721,715 B2
Image pickup device, method of manufacturing image pickup device, and electronic apparatus
Shinya Sato, Kanagawa (JP)
Assigned to SONY GROUP CORPORATION, Tokyo (JP)
Filed by Sony Group Corporation, Tokyo (JP)
Filed on May 12, 2021, as Appl. No. 17/318,664.
Application 17/318,664 is a continuation of application No. 16/506,113, filed on Jul. 9, 2019, granted, now 11,056,524.
Application 16/506,113 is a continuation of application No. 15/886,471, filed on Feb. 1, 2018, granted, now 10,381,392, issued on Aug. 13, 2019.
Application 15/886,471 is a continuation of application No. 14/506,843, filed on Oct. 6, 2014, granted, now 9,929,200, issued on Mar. 27, 2018.
Claims priority of application No. 2013-213645 (JP), filed on Oct. 11, 2013.
Prior Publication US 2021/0265398 A1, Aug. 26, 2021
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/1463 (2013.01) [H01L 27/1464 (2013.01); H01L 27/1469 (2013.01); H01L 27/14634 (2013.01); H01L 27/14641 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An imaging device comprising:
a semiconductor substrate comprising a light-receiving region and a peripheral region, the light-receiving region including a photoelectric conversion region;
a first separation region disposed in the light-receiving region;
a second separation region disposed in the peripheral region; and
a third separation region disposed in the peripheral region and disposed under the second separation region in the semiconductor substrate,
wherein the third separation region includes a first portion, a second portion, and a third portion in a cross-sectional view,
wherein the second separation region is disposed between the first portion and the third portion in the cross-sectional view,
wherein the second separation region contacts with the second portion of the third separation region, and
wherein a width of the first portion is different than a width of the third portion in the cross-sectional view.