US 11,721,710 B2
Stitched integrated circuit dies
Nicholas Paul Cowley, Wroughton (GB); and Andrew David Talbot, Chieveley (GB)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Oct. 26, 2020, as Appl. No. 16/949,323.
Claims priority of provisional application 62/954,809, filed on Dec. 30, 2019.
Prior Publication US 2021/0202555 A1, Jul. 1, 2021
Int. Cl. H01L 27/146 (2006.01); G03F 1/38 (2012.01); G03F 1/42 (2012.01)
CPC H01L 27/14625 (2013.01) [G03F 1/38 (2013.01); G03F 1/42 (2013.01); H01L 27/14605 (2013.01); H01L 27/14687 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A reticle set for patterning an image sensor die, the reticle set comprising:
a center tile having a first pattern image associated with pixel circuitry, the center tile having a first length along a first dimension; and
a peripheral tile having a second pattern image associated with control circuitry for the pixel circuitry, the second pattern image containing first and second pattern image portions associated with the control circuitry for the pixel circuitry that have respective lengths summing to a second length of the peripheral tile along the first dimension, wherein a ratio of the first length of the center tile to the second length of the peripheral tile is a non-integer ratio.