US 11,721,676 B2
Package structure with dummy die
Hsien-Wei Chen, Hsinchu (TW); and Li-Hsien Huang, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed on Jul. 24, 2020, as Appl. No. 16/937,741.
Application 16/937,741 is a continuation of application No. 16/396,053, filed on Apr. 26, 2019, granted, now 10,727,211.
Application 16/396,053 is a continuation of application No. 15/893,109, filed on Feb. 9, 2018, granted, now 10,276,549, issued on Apr. 30, 2019.
Application 15/893,109 is a continuation of application No. 15/268,843, filed on Sep. 19, 2016, granted, now 9,922,964, issued on Mar. 20, 2018.
Prior Publication US 2020/0365570 A1, Nov. 19, 2020
Int. Cl. H01L 25/10 (2006.01); H01L 23/538 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 25/105 (2013.01) [H01L 23/49838 (2013.01); H01L 23/5389 (2013.01); H01L 24/09 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 25/0652 (2013.01); H01L 25/50 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/92244 (2013.01); H01L 2224/97 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06548 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/107 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/3511 (2013.01); H01L 2924/3512 (2013.01); H01L 2924/37001 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a package component;
a dummy die disposed over the package component;
a device die adjacent to the dummy die, wherein the device die comprises a conductive pad, and the conductive pad is electrically connected to the package component; and
a buffer layer formed below the dummy die, wherein the buffer layer has a first surface and an opposite second surface, the first surface is in direct contact with a bottom surface of the dummy die and the second surface is in direct contact with a package layer.