US 11,721,659 B2
Package structure with warpage-control element
Hao-Jan Pei, Hsinchu (TW); Chih-Chiang Tsao, Taoyuan (TW); Wei-Yu Chen, Taipei (TW); Hsiu-Jen Lin, Zhubei (TW); Ming-Da Cheng, Taoyuan (TW); Ching-Hua Hsieh, Hsinchu (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jun. 28, 2021, as Appl. No. 17/360,681.
Application 17/360,681 is a continuation of application No. 16/876,371, filed on May 18, 2020, granted, now 11,049,832.
Application 16/876,371 is a continuation of application No. 16/398,119, filed on Apr. 29, 2019, granted, now 10,658,323, issued on May 19, 2020.
Application 16/398,119 is a continuation of application No. 15/499,962, filed on Apr. 28, 2017, granted, now 10,276,536, issued on Apr. 30, 2019.
Prior Publication US 2021/0327840 A1, Oct. 21, 2021
Int. Cl. H01L 23/00 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 25/10 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); H01L 21/683 (2006.01); H01L 25/11 (2006.01)
CPC H01L 24/19 (2013.01) [H01L 21/565 (2013.01); H01L 21/6835 (2013.01); H01L 23/293 (2013.01); H01L 23/3128 (2013.01); H01L 24/13 (2013.01); H01L 24/25 (2013.01); H01L 24/73 (2013.01); H01L 24/96 (2013.01); H01L 25/105 (2013.01); H01L 25/115 (2013.01); H01L 2221/68345 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/19 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/25171 (2013.01); H01L 2224/73209 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1058 (2013.01); H01L 2924/3511 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a semiconductor die;
a molding compound layer surrounding the semiconductor die;
a conductive bump over the molding compound layer;
a first polymer-containing layer surrounding and in contact with the conductive bump; and
a second polymer-containing layer disposed over the first polymer-containing layer, wherein a bottom surface of the conductive bump is below a bottom surface of the second polymer-containing layer, wherein a direct projection of the second polymer-containing layer on the first polymer-containing layer is laterally surrounded by outermost edges of the first polymer-containing layer.