CPC H01L 24/13 (2013.01) [H01L 24/11 (2013.01); H01L 24/03 (2013.01); H01L 24/04 (2013.01); H01L 24/05 (2013.01); H01L 24/16 (2013.01); H01L 2224/03912 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05562 (2013.01); H01L 2224/1146 (2013.01); H01L 2224/1182 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/13019 (2013.01); H01L 2224/1357 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13564 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16503 (2013.01)] | 25 Claims |
1. An integrated device comprising:
a die portion comprising:
a plurality of pads; and
a plurality of under bump metallization interconnects coupled to the plurality of pads; and
a plurality of pillar interconnects coupled to the plurality of under bump metallization interconnects, wherein the plurality of pillar interconnects comprises a first pillar interconnect comprising:
a first cavity;
a first pillar interconnect portion comprising a first width of the bottom most portion of the first pillar interconnect portion closest to the die portion; and
a second pillar interconnect portion comprising a second width that is less than the first width, the first cavity located in the second pillar interconnect portion.
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