US 11,721,654 B2
Ultra-thin multichip power devices
Nurul Nadiah Manap, Seremban (MY); Shutesh Krishnan, Seremban (MY); and Soon Wei Wang, Seremban (MY)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Feb. 22, 2021, as Appl. No. 17/249,154.
Application 17/249,154 is a division of application No. 15/939,843, filed on Mar. 29, 2018, granted, now 10,930,604.
Prior Publication US 2021/0183799 A1, Jun. 17, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/065 (2023.01); H01L 23/00 (2006.01)
CPC H01L 24/06 (2013.01) [H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 2224/16245 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/14 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method comprising:
attaching a plurality of semiconductor die to a temporary carrier substrate between copper pillars disposed on the temporary carrier substrate, each of the plurality of semiconductor die having a backside metal drain contact;
covering the plurality of semiconductor die and the copper pillars on the temporary carrier substrate with molding material;
backside grinding the molding material to expose first ends of the copper pillars and the backside metal drain contacts of the plurality of semiconductor die;
applying a first layer of conductive material to electrically connect the first ends of the copper pillars and backside metal drain contacts of the plurality of semiconductor die;
cutting grooves in the first layer of conductive material to isolate pairs of adjacent semiconductor dies of the plurality of semiconductor die to be contained in individual multi-chip module (MCM) packages, each pair of adjacent semiconductor die including a first semiconductor die and a second semiconductor die;
removing the temporary carrier substrate to expose second ends of the copper pillars in place in the molding material;
applying a second layer of conductive material to electrically connect the second ends of the copper pillars and source contacts of the pairs of adjacent semiconductor die; and
singulating the individual MCM packages, each individual MCM package including the first semiconductor die and the second semiconductor die of a pair of adjacent semiconductor die with a source of the first semiconductor die connected to a drain of the second semiconductor die via one of the copper pillars left in place in the molding material.