US 11,721,647 B2
Integrated fuse
Pascal Fornara, Pourrieres (FR)
Assigned to STMicroelectronics (Rousset) SAS, Rousset (FR)
Filed by STMicroelectronics (Rousset) SAS, Rousset (FR)
Filed on Mar. 30, 2021, as Appl. No. 17/217,005.
Application 17/217,005 is a division of application No. 16/358,223, filed on Mar. 19, 2019, granted, now 10,991,664.
Claims priority of application No. 1852417 (FR), filed on Mar. 21, 2018.
Prior Publication US 2021/0217711 A1, Jul. 15, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/62 (2006.01); H01H 85/02 (2006.01); H01L 23/525 (2006.01); H01L 21/66 (2006.01)
CPC H01L 23/62 (2013.01) [H01H 85/0241 (2013.01); H01L 22/34 (2013.01); H01L 23/5256 (2013.01); H01H 2085/0283 (2013.01)] 12 Claims
OG exemplary drawing
 
1. An integrated device, comprising:
a substrate;
at least one sealing ring at a periphery of the substrate; and
an electrically conductive fuse element extending from a first location inside the integrated device to outside said at least one sealing ring and passing through an opening in a conductive contact wall of said at least one sealing ring;
wherein an outer portion of the electrically conductive fuse element situated outside said at least one sealing ring has a free end; and
wherein a portion of the electrically conductive fuse element that passes through said opening in the conductive contact wall of at least one sealing ring is electrically isolated from said conductive contact wall and from the substrate.