US 11,721,639 B2
Multi-component modules (MCMs) including configurable electro-magnetic isolation (EMI) shield structures, and related methods
Jay Scott Salmon, San Diego, CA (US); and Anirudh Bhat, San Diego, CA (US)
Assigned to QUALCOMM INCORPORATED, San Diego, CA (US)
Filed by QUALCOMM Incorporated, San Diego, CA (US)
Filed on Jun. 2, 2021, as Appl. No. 17/336,512.
Claims priority of provisional application 63/045,509, filed on Jun. 29, 2020.
Prior Publication US 2021/0407927 A1, Dec. 30, 2021
Int. Cl. H01L 23/552 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/14 (2006.01); H01L 23/367 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/14 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6605 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/3025 (2013.01)] 39 Claims
OG exemplary drawing
 
1. A multi-component module (MCM), comprising:
an electrical device mounted on a top surface of a substrate comprising a ground layer; and
an electromagnetic interference (EMI) shield disposed adjacent to the top surface of the substrate and proximate to the electrical device, the EMI shield comprising:
a shield lid adjacent to a first side of the electrical device; and
a side-wall structure disposed adjacent to at least a second side of the electrical device, the side-wall structure comprising:
a wall medium; and
a vertical conductor disposed at least one of on and inside the wall medium and configured to electrically couple the shield lid to the ground layer of the substrate,
wherein:
the shield lid comprises a conductive layer extending parallel to the top surface of the substrate, adjacent to the electrical device and the side-wall structure;
the side-wall structure extends in a direction orthogonal to the top surface of the substrate between the top surface of the substrate and the shield lid;
the surface of the wall medium on which the conductive material is disposed comprises at least a semi-cylindrical surface of a side-wall having a longitudinal axis extending through a thickness of the wall medium; and
the vertical conductor disposed on the wall medium further comprises a semi-cylindrical conductive layer disposed on the semi-cylindrical surface and between the surface and the electrical device.