CPC H01L 23/552 (2013.01) [H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 23/14 (2013.01); H01L 23/3675 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 2223/6605 (2013.01); H01L 2224/16237 (2013.01); H01L 2924/1632 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/3025 (2013.01)] | 39 Claims |
1. A multi-component module (MCM), comprising:
an electrical device mounted on a top surface of a substrate comprising a ground layer; and
an electromagnetic interference (EMI) shield disposed adjacent to the top surface of the substrate and proximate to the electrical device, the EMI shield comprising:
a shield lid adjacent to a first side of the electrical device; and
a side-wall structure disposed adjacent to at least a second side of the electrical device, the side-wall structure comprising:
a wall medium; and
a vertical conductor disposed at least one of on and inside the wall medium and configured to electrically couple the shield lid to the ground layer of the substrate,
wherein:
the shield lid comprises a conductive layer extending parallel to the top surface of the substrate, adjacent to the electrical device and the side-wall structure;
the side-wall structure extends in a direction orthogonal to the top surface of the substrate between the top surface of the substrate and the shield lid;
the surface of the wall medium on which the conductive material is disposed comprises at least a semi-cylindrical surface of a side-wall having a longitudinal axis extending through a thickness of the wall medium; and
the vertical conductor disposed on the wall medium further comprises a semi-cylindrical conductive layer disposed on the semi-cylindrical surface and between the surface and the electrical device.
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