CPC H01L 23/544 (2013.01) [H01L 21/78 (2013.01); H01L 22/20 (2013.01); H01L 2223/5446 (2013.01); H01L 2223/54426 (2013.01)] | 20 Claims |
1. A semiconductor wafer, comprising:
a semiconductor body;
an insulation layer on the semiconductor body;
a scribeline region designated to be subjected to a wafer separation processing stage; and
an optically detectable reference feature laterally spaced inward from the scribeline region and configured to be a reference position during the wafer separation processing stage,
wherein the optically detectable reference feature extends into a subsection of an exposed section of the insulation layer.
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