CPC H01L 23/544 (2013.01) [B41J 2/17546 (2013.01); H01L 21/68 (2013.01); H01L 2223/54426 (2013.01)] | 11 Claims |
1. A circuit die assembly comprising:
a circuit die comprising:
an outermost circuit layer having electrical transmission routings;
a first alignment target overlying the outermost circuit layer;
a second alignment target formed at or below the outermost circuit layer;
a bond pad region, wherein the second alignment target is within the bond pad region; and
an encapsulant covering the second alignment target while the first alignment target remains uncovered by the encapsulant.
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