CPC H01L 23/53276 (2013.01) [H01L 21/76802 (2013.01); H01L 21/76846 (2013.01); H01L 21/76864 (2013.01); H01L 21/76871 (2013.01); H01L 21/76877 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01)] | 20 Claims |
1. A device comprising:
a conductive feature at least partially disposed within a dielectric layer;
a via electrically connected to the conductive feature;
a graphene layer disposed directly on the conductive feature;
a seed layer extending from the graphene layer to the via such that the seed layer interfaces with both the graphene layer and the via; and
a pre-fill layer disposed directly on the graphene layer.
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