US 11,721,607 B2
Integrated circuit assemblies having metal foam structures
Aastha Uppal, Chandler, AZ (US); and Je-Young Chang, Tempe, AZ (US)
Assigned to Intel Corporation, Santa Clara, CA (US)
Filed by INTEL CORPORATION, Santa Clara, CA (US)
Filed on Jan. 23, 2020, as Appl. No. 16/750,213.
Prior Publication US 2021/0233832 A1, Jul. 29, 2021
Int. Cl. H01L 23/42 (2006.01); H01L 21/56 (2006.01)
CPC H01L 23/42 (2013.01) [H01L 21/56 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit assembly, comprising:
an electronic substrate;
at least one integrated circuit device electrically attached to the electronic substrate;
a heat dissipation device;
a thermal interface material between the at least one integrated circuit device and the heat dissipation device; and
a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material.