CPC H01L 23/42 (2013.01) [H01L 21/56 (2013.01)] | 20 Claims |
1. An integrated circuit assembly, comprising:
an electronic substrate;
at least one integrated circuit device electrically attached to the electronic substrate;
a heat dissipation device;
a thermal interface material between the at least one integrated circuit device and the heat dissipation device; and
a metal foam surrounding the at least one integrated circuit device and contacting the thermal interface material.
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