CPC H01L 23/3672 (2013.01) [H01L 21/4882 (2013.01); H01L 21/6835 (2013.01)] | 24 Claims |
1. An electronic assembly comprising:
(a) a wafer defining at least one cavity;
(b) a chip disposed in the at least one cavity; and
(c) a metal heat spreader disposed in the at least one cavity, the chip being embedded in the metal heat spreader;
wherein the metal heat spreader comprises at least one elongate microstructure separated from a remainder of the metal heat spreader by at least one channel, the at least one elongate microstructure comprising one end detached from any other structure;
wherein the metal heat spreader occupies an area within the cavity that is not occupied by the chip; and
wherein the at least one elongate microstructure is configured and arranged in the cavity so as to improve thermal management of the chip by reducing stress across the chip as compared with a configuration and arrangement in which a heat spreader made of the metal and occupying the area within the cavity is a solid without channels.
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