US 11,721,600 B2
Method for forming hermetic package for a power semiconductor
Saeed Shafiyan-Rad, Nashua, NH (US); Manuel Medeiros, III, New Bedford, MA (US); and David Scott Doiron, Ashburnham, MA (US)
Assigned to Microsemi Corporation, Chandler, AZ (US)
Filed by Microsemi Corporation, Chandler, AZ (US)
Filed on Dec. 21, 2020, as Appl. No. 17/129,144.
Application 17/129,144 is a division of application No. 16/374,704, filed on Apr. 3, 2019, granted, now 10,903,128.
Claims priority of provisional application 62/806,573, filed on Feb. 15, 2019.
Prior Publication US 2021/0159130 A1, May 27, 2021
Int. Cl. H01L 23/10 (2006.01); H01L 23/06 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01)
CPC H01L 23/10 (2013.01) [H01L 23/06 (2013.01); H01L 23/3672 (2013.01); H01L 24/09 (2013.01); H01L 24/34 (2013.01); H01L 24/49 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 2224/48247 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A method of fabricating a hermetic electronic package comprising:
providing a package body;
hermetically coupling a package base plate to a first end of the package body;
thermally coupling a substrate to the base plate, the substrate having a plurality of metalized regions;
mounting a semiconductor device to the substrate, the semiconductor device having at least one high-current output electrically bonded to a first metalized region of the substrate;
bonding at least one high-current input/output (I/O) terminal to the first metalized region of the substrate by a strap terminal that is an integral high current heatsink terminal, the at least one high-current I/O terminal passing through a respective hole formed in the package body;
hermetically bonding to an outer surface of the package body a ceramic seal surrounding the at least one high-current I/O terminal by brazing a first surface of the ceramic seal to the outer surface of the package body;
hermetically bonding a metal hermetic seal washer surrounding the at least one high-current I/O terminal to the ceramic seal and to a portion of the at least one high-current I/O terminal that passes through the metal hermetic seal washer by brazing the metal hermetic seal washer to a second surface of the ceramic seal and to the portion of the at least one high-current I/O terminal that passes through the metal hermetic seal washer; and
seam welding a lid onto the package body at a second end opposite the first end to form a hermetic seal with the package body.