US 11,721,597 B2
Semiconductor device and manufacturing method of the same
Yang-Che Chen, Hsin-Chu (TW); Chen-Hua Lin, Yunlin County (TW); Victor Chiang Liang, Hsinchu (TW); Huang-Wen Tseng, Hsinchu County (TW); and Chwen-Ming Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed by TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu (TW)
Filed on Aug. 30, 2021, as Appl. No. 17/461,479.
Prior Publication US 2023/0064152 A1, Mar. 2, 2023
Int. Cl. H01L 21/66 (2006.01); H01L 23/40 (2006.01); H01L 23/58 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 22/32 (2013.01) [H01L 22/14 (2013.01); H01L 23/4006 (2013.01); H01L 23/585 (2013.01); H01L 24/20 (2013.01); H01L 24/13 (2013.01); H01L 25/0655 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/221 (2013.01); H01L 2224/2205 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a packaging structure comprising a redistribution layer and a detecting component disposed in the redistribution layer;
a cooling plate over the packaging structure; and
a fixing component penetrating through the packaging structure and the cooling plate, the packaging structure and the cooling plate being fixed by the fixing component,
wherein the detecting component is in a chain configuration having a ring shaped structure circling around the fixing component.