US 11,721,583 B2
Mainframe-less wafer transfer platform with linear transfer system for wafer processing modules
Sriskantharajah Thirunavukarasu, Singapore (SG); Karthik Balakrishnan, Singapore (SG); Karthik Elumalai, Singapore (SG); and Eng Sheng Peh, Singapore (SG)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 10, 2020, as Appl. No. 16/989,746.
Prior Publication US 2022/0044968 A1, Feb. 10, 2022
Int. Cl. H01L 21/78 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); B23K 26/364 (2014.01); H01L 23/544 (2006.01); B23K 101/40 (2006.01)
CPC H01L 21/78 (2013.01) [B23K 26/364 (2015.10); H01L 21/673 (2013.01); H01L 21/67739 (2013.01); H01L 23/544 (2013.01); B23K 2101/40 (2018.08); H01L 2223/5446 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A semiconductor processing tool for implementing hybrid laser and plasma dicing of a substrate, comprising:
a transfer module, wherein the transfer module comprises a track robot for handling the substrate;
a first loadlock attached to the transfer module, wherein the first loadlock comprises a first linear transfer system for handling the substrate;
a processing chamber attached to the first loadlock, wherein the first linear transfer system of the first loadlock is configured to insert and remove the substrate from the processing chamber; and
a second loadlock attached to the transfer module, wherein the second loadlock comprises a second linear transfer system for handling the substrate.