CPC H01L 21/67288 (2013.01) [H01L 21/02057 (2013.01); H01L 21/67051 (2013.01); H01L 22/12 (2013.01)] | 20 Claims |
1. A method, comprising:
receiving a die vessel at a disassembly station;
determining whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassembling multiple parts of the die vessel when the die vessel comprises the first type of die vessel, wherein the determining comprises measuring a weight of the die vessel;
receiving the die vessel at a cleaning station;
cleaning one or more parts of the die vessel at the cleaning station;
receiving the die vessel at an inspection station;
inspecting the die vessel at the inspection station after cleaning to determine whether the die vessel is identified as passing inspection;
moving the die vessel along a conveyor between the cleaning station and the inspection station; and
moving the die vessel to a pass output port or a fail output port based on whether the die vessel is identified as passing inspection.
|
6. A method, comprising:
receiving a die vessel at a disassembly station, the die vessel containing at least one semiconductor die therein;
determining whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassembling multiple parts of the die vessel when the die vessel comprises the first type of die vessel, wherein the determining comprises measuring a weight of the die vessel;
cleaning one or more parts of the die vessel at a cleaning station; and
inspecting the one or more parts of the die vessel at an inspection station after cleaning to determine whether the die vessel is identified as passing inspection.
|