US 11,721,572 B2
Integrated semiconductor die vessel processing workstations
Tsung-Sheng Kuo, Hsin-Chu (TW); Guan-Wei Huang, Hsin-Chu (TW); Chih-Hung Huang, Hsin-Chu (TW); Yang-Ann Chu, Hsin-Chu (TW); Hsu-Shui Liu, Pingjhen (TW); and Jiun-Rong Pai, Jhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 26, 2022, as Appl. No. 17/874,174.
Application 17/874,174 is a division of application No. 16/518,352, filed on Jul. 22, 2019, granted, now 11,488,848.
Claims priority of provisional application 62/712,656, filed on Jul. 31, 2018.
Prior Publication US 2022/0359248 A1, Nov. 10, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/66 (2006.01); H01L 21/02 (2006.01)
CPC H01L 21/67288 (2013.01) [H01L 21/02057 (2013.01); H01L 21/67051 (2013.01); H01L 22/12 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
receiving a die vessel at a disassembly station;
determining whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassembling multiple parts of the die vessel when the die vessel comprises the first type of die vessel, wherein the determining comprises measuring a weight of the die vessel;
receiving the die vessel at a cleaning station;
cleaning one or more parts of the die vessel at the cleaning station;
receiving the die vessel at an inspection station;
inspecting the die vessel at the inspection station after cleaning to determine whether the die vessel is identified as passing inspection;
moving the die vessel along a conveyor between the cleaning station and the inspection station; and
moving the die vessel to a pass output port or a fail output port based on whether the die vessel is identified as passing inspection.
 
6. A method, comprising:
receiving a die vessel at a disassembly station, the die vessel containing at least one semiconductor die therein;
determining whether the die vessel comprises a first type of die vessel or a second type of die vessel, and disassembling multiple parts of the die vessel when the die vessel comprises the first type of die vessel, wherein the determining comprises measuring a weight of the die vessel;
cleaning one or more parts of the die vessel at a cleaning station; and
inspecting the one or more parts of the die vessel at an inspection station after cleaning to determine whether the die vessel is identified as passing inspection.