US 11,721,570 B2
Wafer notch leveling device
Min-Chih Tseng, Xionglin Township (TW); and Ching-Yu Hsiao, Xionglin Township (TW)
Assigned to Sanwa Engineering Corp., Xionglin Township (TW)
Filed by Sanwa Engineering Corp., Xionglin Township, Hsinchu County (TW)
Filed on Jul. 23, 2020, as Appl. No. 16/936,568.
Prior Publication US 2022/0028717 A1, Jan. 27, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 23/544 (2006.01); H01L 21/68 (2006.01)
CPC H01L 21/67282 (2013.01) [H01L 21/681 (2013.01); H01L 23/544 (2013.01); H01L 2223/54493 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A wafer notch leveling device, comprising:
a body, having a support portion and a pivot portion being provided at each terminal of the body, the pivot portion pivotally connects a plurality of supporting arms;
a first rotating portion, having a driving wheel and an auxiliary wheel;
a positioning portion, disposing with a positioning part and a detaching fulcrum;
a power portion, having a first power member electrically connected with the pivot portion for driving the supporting arms to move up and down, a second power member electrically connected with the first rotating portion for rotating and a third power member electrically connected with the positioning portion for moving up and down;
a control unit, electrically connecting with the power portion for controlling setup and operation of all portions;
wherein the supporting arms further comprise a first directional supporting arm and a second directional supporting arm.